JPH0452998Y2 - - Google Patents
Info
- Publication number
- JPH0452998Y2 JPH0452998Y2 JP18702286U JP18702286U JPH0452998Y2 JP H0452998 Y2 JPH0452998 Y2 JP H0452998Y2 JP 18702286 U JP18702286 U JP 18702286U JP 18702286 U JP18702286 U JP 18702286U JP H0452998 Y2 JPH0452998 Y2 JP H0452998Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- lid
- conductor
- resin
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004020 conductor Substances 0.000 claims description 63
- 239000011347 resin Substances 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 37
- 239000004065 semiconductor Substances 0.000 claims description 27
- 238000007789 sealing Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 8
- 230000000630 rising effect Effects 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- -1 polybutylene terephthalate Polymers 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18702286U JPH0452998Y2 (en]) | 1986-12-04 | 1986-12-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18702286U JPH0452998Y2 (en]) | 1986-12-04 | 1986-12-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6390850U JPS6390850U (en]) | 1988-06-13 |
| JPH0452998Y2 true JPH0452998Y2 (en]) | 1992-12-14 |
Family
ID=31137116
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18702286U Expired JPH0452998Y2 (en]) | 1986-12-04 | 1986-12-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0452998Y2 (en]) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4907068A (en) * | 1987-01-21 | 1990-03-06 | Siemens Aktiengesellschaft | Semiconductor arrangement having at least one semiconductor body |
-
1986
- 1986-12-04 JP JP18702286U patent/JPH0452998Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6390850U (en]) | 1988-06-13 |
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